Unibody MEMS wafer probing patent list:

• US Patent 6,265,888 : Wafer Probe Card. By Hsu, Howard.
• US Patent 20,030,141,889 : Vertical probe card and method for using the same by Chen, HH; and Hsu, H.
• US Patent 20,030,222,668 : Method for producing micro probe tips by Hung.WC and Hsu, H.
• US Patent (IP) : Unibody MEMS probe card with tip shape for ultra high pin counts by HSU FU CHANG and HOWARD FU-JYA HSU.

Inter-relation of all process parameters: Chemicals, Temp., Plasma, double side process…. etc