Micro-Electromechanical Systems (MEMS) are highly miniaturized electromechanical systems that integrate technologies across optics, mechanics, electronics, materials science, and biochemistry. Built using advanced wafer fabrication processes, MEMS enables performance, reliability, and cost-efficiency beyond what traditional systems can achieve. Long-term, MEMS applications span from biotechnology to aerospace.

AGI, led by Dr. Howard Hsu and a team of experts from Silicon Valley and Taiwan, has developed a MEMS-based probe card specifically for advanced semiconductortesting. This solution targets Known Good Die (KGD) testing in modern high-performance chips, offering a cost-effective, scalable, and reliable solution.

As chip design enters the 2nm node era, transistor density continues to increase, pushing pin counts into the thousands. Traditional edge-probing methods can no longer handle matrix-style pad arrangements. The tighter ball pitch of modern chip designs often requires costly silicon interposers to match PCB test limitations.

AGI’s MEMS probes can bypass these challenges by directly interfacing with fine-pitch arrays—eliminating the need for interposers and significantly reducing designand testing costs. This positions MEMS probes as an essential enabler of next-generation IC packaging and testing.

AGI leverages wafer and ceramic integrated MEMS synthesis to create a Unibody MEMS Probe Card (UMPC), offering:

● Sub-1μm coplanarity for ultra-precise contact

● No tip cleaning required, lowering operational cost

● Durability: >100,000 test cycles per probe vs. 3,000 for conventional probes, Lifetime test over 1M touchdown.

● 12x efficiency over traditional probe cards—eliminating downtime and backup card requirements

● Unibody ceramic design prevents probe tip distortion and ensures long-term stability

Verified by multiple OEM and foundry partners, AGI’s solution dramatically improves yield, testing reliability, and cost-efficiency in logic chip production.