About AGI

In the early 2000s, Taiwan emerged as a global powerhouse in the semiconductor foundry industry. During this pivotal time, the founding members of AGI were at the forefront of innovation—pioneering cutting-edge semiconductor testing technologies in the United States. This breakthrough technology was later transferred to Taiwan, where the team led its full-scale R&D and production implementation. 


The resulting commercial product—backed by over NT$1 billion in development costs (equivalent to approximately $56 million USD In today’s value)—successfully completed 1 million endurance test cycles by 2006 and secured major orders from industry leaders including Intel and Texas Instruments.

However, at that time, mainstream chips featured around 1,000 pins and could be adequately tested using conventional mechanical probes. MEMS-based testing was technologically ahead of its time and commercially unnecessary.


Fast forward to the 2020s: The explosion of AI, high-performance computing (HPC), and advanced CPU designs has driven chip complexity to new heights—now requiring several thousand electrical contacts per chip. Traditional mechanical probes are no longer viable. The current industry standard, Mixed MEMS Probe Cards (MMPCs), integrates MEMS probes into PCB substrates. However, MMPCs suffer from high production complexity, increased cost, and limited scalability.

However, at that time, mainstream chips featured around 1,000 pins and could be adequately tested using conventional mechanical probes. MEMS-based testing was technologically ahead of its time and commercially unnecessary.


Fast forward to the 2020s: The explosion of AI, high-performance computing (HPC), and advanced CPU designs has driven chip complexity to new heights—now requiring several thousand electrical contacts per chip. Traditional mechanical probes are no longer viable. The current industry standard, Mixed MEMS Probe Cards (MMPCs), integrates MEMS probes into PCB substrates. However, MMPCs suffer from high production complexity, increased cost, and limited scalability.